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April 2008

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Wed, 16 Apr 2008 07:47:35 -0500
Content-Type:
text/plain
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text/plain (93 lines)
Good Morning Jan!

I have your photos posted. They're at:

http://stevezeva.homestead.com/files/tantal01.jpg

and:

http://stevezeva.homestead.com/files/tantal02.jpg 

In my opinion it's not a defect. I don't know how you would prevent the
solder from wicking there during reflow...but that's just my opinion.

In fact what I'll do is ask an IPC Master Instructor that we have here
certifying some people here for -610 instructors and see what he says.

Kind regards,

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lamote, Jan
Sent: Tuesday, April 15, 2008 11:16 AM
To: [log in to unmask]
Subject: [TN] Inward formed L-shaped ribbon lead - solder

Technet,
During cross section analysis we came across the section of a tantalum
capacitor.
The soldering was flagged as non conform IPC-A 610D. 
In section 8.2.11 Inward Formed L-Shaped Ribbon Leads, table 8-11
indicates for class 1, 2 and 3 states for the maximum fillet height
:"Solder does not contact the component body on the inside of the lead
bend."

If you now have a contact between the bottom corner of the component
body and the solder, is this a defect ? 
(have some pictures if needed, don't know if there still is a "technet
image upload service")

After asking different people I got answers ranging from "reliability
hazard" to "common with these types of components and acceptable"
(including independent lab, EMS, IPC training organisation...)

If something is a defect in all classes, seems to me that there must be
good reason why it is unwanted.
If it is common and acceptable, then I would expect to see it listed as
such in the standard.

Can anyone explain how this rule needs to be interpreted and what the
real dangers are ?

thanks,
Jan.



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