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April 2008

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Subject:
From:
Chris Schaefer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Chris Schaefer <[log in to unmask]>
Date:
Wed, 30 Apr 2008 11:58:25 -0500
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TechTeam,

We are in the very beginning stages of starting a conversion from one hand
cleaning solvent to another more effective one. I am curious what makes the
most sense in terms of methods to use to qualify as well as what is the likely
norm from the industry? We are required to perform SIR or ECM, and IC testing
by various customers prior to any changes which I think is a good thing, but
what would be the application process of flux, soldering, and finally cleaning?
As well as the actual soldering and cleaning process. With the various
geometries, spacing, ground planes, thermal requirements, materials, time,
etc... How would best capture the effectiveness of the new solvent? We are
currently using an RMA 15% solid flux, hand soldering with 600-700dgree tips
on multi-layer product from FR4 to teflon. I hope I didn't open a huge can-o-
worms.

Thanks all and have a great day!

Chris

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