No guarantees, but try contacting http://cave.auburn.edu. We work with
them on lead free soldering I&RD projects. NASA works with them. You can
only find out if they are working on what you are looking for but have
to join to access any reports. It is expensive, Jon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bruce, David (GB -
MAV)
Sent: Tuesday, April 29, 2008 3:08 AM
To: [log in to unmask]
Subject: [TN] Software package to perform fatigue life prediction of
solder joints
Does anyone know of a software package to perform fatigue life
prediction of solder joints.
I need to be able to predict the fatigue life of solder joints under
different thermal cycling and vibration load conditions. The PCB will
usually be FR4, the solder tin/lead, the components everything from
BGA's to chip passives. Ideally I need to provide an estimate on cycles
to failure.
We are trying to do a comparison exercise to try and specify the more
reliable component, for example, a chip capacitor in 0805 or 1206, which
one will be more reliable, from a solder joint perspective and by what
order of magnitude? And what would the expected life of the joint be
under different conditions?
We need to perform this exercise over a range of different types of
components, using different types of leaded solder and perhaps with
different board thicknesses. Predictive software would be quicker and
easier than empirical experiments.
Any ideas?
Regards
David
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