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April 2008

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 25 Apr 2008 19:54:33 EDT
Content-Type:
text/plain
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text/plain (34 lines)
Hi Genny,
add via barel cracking;
plating uniformity;
keeping non-functional lands;
minimize number of prepreg layers;
increase hole plating thickness;
test plating quality/properties more often;
testing of coupons by IST or HATS;
moisture bake-out;
choice of resin system.
My White Paper certainly would help and give you an understanding of the
various issues.


Werner



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