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April 2008

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Subject:
From:
Michelle Michelotti <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Michelle Michelotti <[log in to unmask]>
Date:
Wed, 23 Apr 2008 15:24:11 -0500
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Why should I participate in IPC technical seminars at National Electronics Week?
To stay ahead of the curve!

Make the most of your time at National Electronics Week.   Stay up to date with in-depth technical seminars presented by
IPC - Association Connecting Electronics Industries.

Explore full course descriptions at www.ipc.org/IPCuk<http://www.ipc.org/IPCuk>.

Technical seminars will take place in a compelling location: Earls Court, Warwick Road, London.

Register now for technical seminars at www.ipc.org/IPCuk<http://www.ipc.org/IPCuk>.  Take advantage of value pricing for this event: £175 for one full-day or two half-day seminars,  £95 for one half-day seminar.   Save 10% on registration with confirmation by 30 May 2008.


Technical Seminar Program at a Glance

Tuesday, 17 June
Achieving High Reliability for Lead-Free Solder Joints - Material Considerations
Ning-Cheng Lee, Ph.D., Indium Corporation of America

Designing PCBs for Lowest Cost - Reducing Layers and Other DfM Principles
Happy Holden, Mentor Graphics

Surface Mount Technology: Principles & Practice in a Lead-Free World
Ray Prasad, Ray Prasad Consultancy Group

Updating Rework and Repair for Lead-Free
Berry Morris, ART Advanced Rework Technology

Lead-Free Reliability for Harsh Environment Electronics
Jennie Hwang, Ph.D., H-Technologies Group

Wednesday, 18 June

Design for Reliability, Reliability Testing & Data Analysis, and Failure Analysis of Lead-Free Solder Joints
John Lau, Ph.D., Institute of Microelectronics

What is HDI? Do you Need HDI? How to Get Started
Happy Holden, Mentor Graphics

Lead-Free BGA Reliability in Packaging and Assembling
Jennie Hwang, Ph.D., H-Technologies Group

Ball Grid Array: Principles and Practice
Ray Prasad, Ray Prasad Consultancy Group
Thursday, 19 June

Stencil Printing Process for Solder Paste Application: An In-Depth Look
S. Manian Ramkumar, Ph.D., Rochester Institute of Technology

Reliability Issues with Lead-Free Soldering Processes
Werner Engelmaier, Engelmaier Associates L.C.

True Design for Reliability: Understanding What Is and What Is Not DfR
Craig Hillman, Ph.D., DfR Solutions

Advanced Component Packages - An Introduction Including Lead-Free Implementation
S. Manian Rumkumar, Ph.D., Rochester Institute of Technology

Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias (PTHs/PTVs) Including Lead-Free Soldering Impact
Werner Engelmaier, Engelmaier Associates L.C.

Understanding Failure and Root-Cause Analysis in Lead-Free Electronics
Craig Hillman, Ph.D., DfR Solutions



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