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April 2008

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Wed, 2 Apr 2008 10:58:03 -0700
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text/plain
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text/plain (48 lines)
I can see using vacuum to hold the flex in order to laminate it to the
curved surface but not the whole thing under vacuum.

This would normally be done using an anisotropic conductive film. What
exactly is the problem? Maintaining co planarity between the flex and the
surface given the curved surface?

John

 
 
John Burke
 
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Chandler
Sent: Wednesday, April 02, 2008 7:01 AM
To: [log in to unmask]
Subject: [TN] Vacuum Assembly

Anyone have experience with using vacuum assembly to attach a flex circuit
to a concave surface using adhesive without voids? Any insight into this
process would be appreciated.

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