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April 2008

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Subject:
From:
Phil Nutting <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Phil Nutting <[log in to unmask]>
Date:
Wed, 16 Apr 2008 13:38:36 -0400
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Ken,

I remember a recent thread that talked about immersion tin being difficult to wave solder after the reflow process.  Had to do with oxidation due to the heat of reflow.  In this thread I don't recall what your board material is, type of plating and type of solder.

Just a thought,

Phil

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Bloomquist
Sent: Wednesday, April 16, 2008 1:32 PM
To: [log in to unmask]
Subject: Re: [TN] Out Gassing

Kat,
I'm going to try and bake some but our oven only goes up to 140 degrees F.
I'm not sure if that will do much. Any idea how long you'd have to bake at
140 to do any good?

Richard,
The pinholes are on the through-hole components and come after wave solder.
By sever I mean about 80% of the through-hole leads exhibit out gassing. We
run hundreds of boards through our wave solder every day and this is the
only board we're seeing this on.

Steve,
We just changed the flux Monday and we do a SG check on it every morning to
keep it in balance.

Dewey,
Play Misty for Me :-)

Roger,
Don't go there even though I'm having five bean soup for lunch, ooh!

Thanks,

KennyB
-----Original Message-----
From: Kathy Kuhlow [mailto:[log in to unmask]]
Sent: Wednesday, April 16, 2008 10:08 AM
To: 'TechNet E-Mail Forum'; Ken Bloomquist
Subject: RE: [TN] Out Gassing

Ken,

What is the humidity been the last few days?  Can you bake some and then
repeat the run to see if the outgassing continues? I have had PCB's that
when baked lost pin holes/blow holes.

Kat


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