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April 2008

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Subject:
From:
Paul Reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]>
Date:
Wed, 2 Apr 2008 09:55:38 -0400
Content-Type:
text/plain
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text/plain (109 lines)
Hi Habib,

Question 7; AOI cannot detect all defects. Usually AOI and Electrical Test (continuity testing) will be used to confirm the board will function and circuits do not violate line width and spacing requirements.

What you did not inquire about, the service we offer, reliability testing. Reliability testing is becoming more popular in the automotive industry and is under investigation , for example, by the European Automotive Industry. Reliability testing will confirm survivability through assembly and reliability in the end use environment. We are also testing for internal material defects like delamination and crazing as part of reliability testing.

Those three tests will still not find many classes of discrepancies including dimensional, registration, and surface finish; to name a few.

To reiterate Dr. Christian's point, one could write a book on the questions you have posted and another book on the questions you did not ask.


Sincerely,

Paul Reid

Program Coordinator

PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1

613 596 4244 ext. 229
Skype paul_reid_pwb
[log in to unmask] <mailto:[log in to unmask]>


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Tuesday, April 01, 2008 11:15 PM
To: [log in to unmask]
Subject: Re: [TN] Various questions

Habib,
A lot of people are at APEX this week.
Many of us don't know the answers to your questions.
Your list is too long. That will turn people off.
Bev
RIM

----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Apr 01 10:14:01 2008
Subject: Re: [TN] Various questions

Is there someone who wants to answer my questions?

Best regards.
  ----- Original Message -----
  From: SAHLI habib
  To: [log in to unmask]
  Sent: Thursday, March 20, 2008 1:01 PM
  Subject: Various questions


  Dear Technetters,

  Can I have the privelege to get brief answers to all my following questions :

  1- Main copper thickness used in Automotive market?
  2- Does Automotive market is asking for copper thickness reduction?
  3- What is the standard maximum and minimum bow and twist for Pcbs with BGA components?
  4- What is the standard tolerance for press-fit PTH?
  5- When is panel plating suggested and When is pattern plating suggested?
  6- What is the standard value for annular ring for Pcbs with high copper thicknes (more than 3 oz)?
  7- Is AOI detecting all the PCB defects? What defects are not detected?
  8- Is the automotive market requesting 100% AOI in internal and external layers?
  9- What the is the maximum offset between copper and solder mask requested in the automotive market?
  10- What the is the maximum offset between copper,solder mask and holes requested in the automotive market?
  11- What is the main surface finish for Automotive?
  12- What product application is used OSP for?
  13- What product application is used ENIG for?
  14- What product application is used Immersion Silver for?
  15- Is Screen printing in use for Automotive market?
  16- Is Screen printing used to mark code matrix?
  17- What is the maximum accepted value of Ionic contamination in Automotive market. (µg Na Cl/square for inch)
  18- Are customers requesting Ioni chromatography or any other similar analysis?
  19- Is the automotive market requesting PEA packaging (Electrostatic Protected Area)?
  20- Is Pollution gas test required for Automotive market?
  21- What are the Significant Characteristics defined by Automotive market?
  22- What are the main characteristics for satndard FR4 base material?
  23- What are the main characteristics for lead free base material?

  Thank you in advance for your support.

  Habib

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