Generally speaking the failure is at the pad interface and no the ball to
pad when doing high speed shear.

It was interesting to read that a resent paper from a solder supplier used
FR4 rather than a high TG material may have wanted to avoid all the pads
falling off.

Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
 
www.ASKbobwillis.com
 
Book your place on Bob's "Step by Step Failure Analysis Workshop" 14th May
www.ASKbobwillis.com/faworkshops.pdf
 
 New "Printed Board Inspection & Quality Control" 3 July
www.ASKbobwillis.com/PCBworkshop.pdf 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
Sent: 28 April 2008 16:34
To: [log in to unmask]
Subject: [TN] SAC shear strength

Hello TechNet,

 

 

I have some questions regarding SAC solder (SAC305 / SAC405 in this case):

 

 

Does lower SJ shear strength equal less IMC brittle failures?

 

How does the cooling rate of SAC affect shear strength?  Does it increase it
or lower it?

 

 

Thank you in advance for your answers and have a nice day !!

 

 

David Tremmel

Value Recovery

 


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