The dye process is similar to those performed in dye & pry process foe
e.g. BGA. Vacuum process during the dye to vacuum put the void/air and
let the dye flow into the gap, if any.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, 30 April 2008 1:06 AM
To: [log in to unmask]
Subject: Re: [TN] Blue Voids
Well, I tried to answer that in my last mail.
(see below)
If I used the wrong words or something,
let me know
The reason for the xsec was just a random sample
to show my boss that the boards from our new
supplier were just as good as the boards from our old
supplier, and we fully expected it to be just fine.
total surprise to see that condition.
don't really know how to interpret it
p.s. i know the pic is fuzzy, but its all I got.
don't have the actual sample
thanks for lookin'
Jack
On 4/29/08, [log in to unmask] <[log in to unmask]>
wrote:
>
> The high mag is fuzzy and too much contrast. Again why was the blue
> dye used for and what is the reason for cross section?
>
> Victor,
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
> Sent: Tuesday, April 29, 2008 11:31 AM
> To: [log in to unmask]
> Subject: Re: [TN] Blue Voids
>
> Here is 1000x if that helps (kinda fuzzy):
>
> http://frontdoor.biz/PCBportal/bluevoid1000.jpg
>
> When I presented these microsections to the supplier,
> he said he couldn't tell if the glass bundle imperfections
> were
> 1) a trick of the light
> 2) caused by the grinding process
> 3) bad material, voids in the bundles.
>
> This question would be resolved by adding blue dye to
> the sample to see if it "soaked in". If it soaks in or
> "penetrates" the bundle, it has to be condition #3.
>
> Now, there is an open question whether the dye
> really penetrated or not.
> Since I haven't heard from either side since then,
> I thought I would ask a few thousand of my closest
> friends if they had ever seen this condition, and if so,
> how the resolved it.
>
> Jack (usually just "the layout guy")
>
>
> .
> On 4/29/08, [log in to unmask] <[log in to unmask]>
> wrote:
> >
> > Not enough high mag to discern details of the polish surface and
> > condition of glass rods.
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
> > Sent: Monday, April 28, 2008 10:03 PM
> > To: [log in to unmask]
> > Subject: [TN] Blue Voids
> >
> > Greetings!
> >
> > Once again I am caught in the middle of a bare board problem,
> > (never the same thing twice!)
> > Maybe after a few more decades of failure I might become more
> > proficient at evaluation, but in the meantime....
> > Does anyone have a quick reaction to this picture?
> >
> > http://frontdoor.biz/PCBportal/bluevoid.jpg
> >
> > I'm told there are voids in the glass fiber bundles.
> > When I reported it to the manufacturer, they asked that blue
> > dye be applied to see the penetration. It all looks blue!
> > (and other areas look "bluer" than the problem area to me)
> > The description in IPC-A-600 is too brief to comprehend
> > and I can't find anything in Printed Circuits Handbook about it.
> > anyway,
> > I'm not doubting anything I've been told by "the experts",
> > my question is:
> >
> > How would you handle this if you saw it in YOUR report?
> >
> > reject?
> > use the boards but ask for corrective action?
> > process indicator but not really a problem?
> > not sure, but monitor with more xsec?
> >
> > onward thru the fog,
> > Jack
>
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