Register today for the upcoming IPC Seminar on Future Advanced Packaging Technology
June 2, 2008
Sunnyvale, Calif.

Electronic packaging technologies are now generally recognized as the gatekeepers of system performance.

By addressing the packaging needs of future electronic products, the electronics industry can continue driving long-standing success in meeting performance, cost and size demands for our products. IPC announces an exceptional seminar that will bring industry leaders together to discuss and assess the key enabling technologies and industry dynamics that are driving advanced packaging techniques.

Connect with innovative technologists, business managers and other industry leaders - this will be an excellent opportunity to meet and exchange ideas with peers. Join your colleagues in charting the future direction of the electronic interconnection and packaging industry. Stay ahead of the curve with this unique event!



Find out more about our upcoming Seminar by copying and pasting www.ipc.org/AdvPack0608<http://www.ipc.org/AdvPack0608> into your browser.  If you have any questions, please contact Michelle Michelotti at +1 847-597-2822 or via email at [log in to unmask]<mailto:[log in to unmask]>.



Location and Hotel Accommodations
The technical conference will be held at the Ramada Silicon Valley, 1217 Wildwood Ave., I-101 at Lawrence Expressway, Sunnyvale, Calif. To reserve your sleeping room, please contact the hotel directly at +1 408-245-5330 or via e-mail at [log in to unmask]<mailto:[log in to unmask]> and ask for the IPC special rate.

Register now to secure your place at this event. Complete the registration form and fax or mail to IPC. For more information, or if the registration deadline has passed, contact an IPC registration representative at +1 847-597-2861 or send an e-mail to [log in to unmask]<mailto:[log in to unmask]>.




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