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March 2008

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Subject:
From:
Ido Mashall <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ido Mashall <[log in to unmask]>
Date:
Sat, 8 Mar 2008 21:09:54 +0200
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If you need another option you can try out US systems that can find surfaces
between organic materials.

There are big ones but maybe handheld (for paint thickness measurement) can
do the work
You can Try Deflesko
http://www.defelsko.com/
but I suppose it will be hard to get the resolution you want.

Cross sectioning did the work for us when we started working with LPI.

best
Ido Mashall

  www.beyond-materials.com


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis Hart
Sent: Friday, March 07, 2008 5:25 PM
To: [log in to unmask]
Subject: [TN] LPI solder resist thickness

Technetters, I'm planning a designed experiment to find a way to control
dimensions of solder dams between surface mount pads. I am not sure of a
good way to measure dam dimensions, however. My concern is cross section may
smear the resist and make any microscopic measurements suspect.

I suspect looking at the resist on a PC board from the top would give a
width measurement, but I would like to measure thickness as well and see how
trapezoidal is the dam profile.

In the IPC test methods manual I did not find any recipe.

Thanks for any comments or guidance.

Louis Hart
Compunetics
Monroeville, PA   USA
[log in to unmask]<mailto:[log in to unmask]>
412-858-1272

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