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March 2008

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Subject:
From:
"Simonik, Dave R. (David)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Simonik, Dave R. (David)
Date:
Fri, 7 Mar 2008 10:51:37 -0500
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  I've measured depth and thickness of features using a good microscope
with a calibrated digital depth gauge attached to the stage of the
microscope. Simply focus on the surface of the mask, and zero out the
depth gauge. Then focus down to the bare laminate or plated surface and
read the thickness off the gauge. 

Dave Simonik
Sanmina SCI
Owego NY Division

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis Hart
Sent: Friday, March 07, 2008 10:25 AM
To: [log in to unmask]
Subject: LPI solder resist thickness

Technetters, I'm planning a designed experiment to find a way to control
dimensions of solder dams between surface mount pads. I am not sure of a
good way to measure dam dimensions, however. My concern is cross section
may smear the resist and make any microscopic measurements suspect.

I suspect looking at the resist on a PC board from the top would give a
width measurement, but I would like to measure thickness as well and see
how trapezoidal is the dam profile.

In the IPC test methods manual I did not find any recipe.

Thanks for any comments or guidance.

Louis Hart
Compunetics
Monroeville, PA   USA
[log in to unmask]<mailto:[log in to unmask]>
412-858-1272

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