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Date: | Fri, 7 Mar 2008 08:05:40 -0500 |
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Hi Technos,
A connector has to be bonded on 2 mil wide traces. Is ENIG suited as a surface finish for bonding? If yes, why, if not, why and if it depends, why?
Or otherwise said, I have a PCB that will get some SMT parts on both sides and then a couple hundred golden fingers will see bonding. I was presented with 2 options for the PCB finish:
a) Immersion Gold : 0.03um Au over 3um Ni over 25±10um Cu
b) ElectroBonding Gold: 0.3um Au over 3um Ni over 25±10um Cu
Which one is to prefer?
Thank you,
Ioan
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