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March 2008

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Mon, 3 Mar 2008 13:17:16 +0100
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would it not be a problem to standardize that? The chip maker and the
package maker then must cooperate like twins. Will be interesting to see
more answers.

Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lars Tegelberg
Sent: den 3 mars 2008 12:48
To: [log in to unmask]
Subject: [TN] Component Pin 1 marking


Hi all,
To save me a couple of days searching I ask all of you instead.

Do you know if there is a standard that specify that a component
manufacturer shall mark the capsule for a BGA where Pin A1 is?
I have found one manufacturer that marks the capsule for two of it's
components where pin A10 and W1 are.


Best Regards,

Lars

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