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Date: | Wed, 5 Mar 2008 09:24:30 -0600 |
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You are correct. There is no voiding guidelines/requirement as viewed
with x-ray for the thermal header solder coverage. The stated 25%
voiding is for the overhang. So what is the consensus that is used in
the industry?
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Wednesday, March 05, 2008 8:14 AM
To: [log in to unmask]
Subject: Re: [TN] QFN Thermal Plane Voiding
Hi Vector! Where is the 25% requirement in A610? I did not find a
requirement listed for the thermal pad coverage.
Dave Hillman
Rockwell Collins
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Victor Hernandez <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
03/05/2008 07:49 AM
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[TN] QFN Thermal Plane Voiding
Fellow TechNetters:
The 25% solder voiding has been an accepted rule of thumb for QFN, Quad
Flat w/No Leads, IPC-A-610D sec. 8.2.13. Is there any other guideline
out there.
Victor,
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