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March 2008

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 5 Mar 2008 09:24:30 -0600
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You are correct.   There is no voiding guidelines/requirement as viewed
with x-ray for the thermal header solder coverage.   The stated 25%
voiding is for the overhang.  So what is the consensus that is used in
the industry?

Victor,



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Wednesday, March 05, 2008 8:14 AM
To: [log in to unmask]
Subject: Re: [TN] QFN Thermal Plane Voiding

Hi Vector! Where is the 25% requirement in A610? I did not find a 
requirement listed for the thermal pad coverage. 

Dave Hillman
Rockwell Collins
[log in to unmask]




Victor Hernandez <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
03/05/2008 07:49 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
[log in to unmask]


To
[log in to unmask]
cc

Subject
[TN] QFN Thermal Plane Voiding






Fellow TechNetters:

The 25% solder voiding has been an accepted rule of thumb for QFN, Quad
Flat w/No Leads, IPC-A-610D sec. 8.2.13.   Is there any other guideline
out there.

Victor,



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