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March 2008

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Subject:
From:
"Gallegos, Luis A." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gallegos, Luis A.
Date:
Wed, 5 Mar 2008 09:08:47 -0600
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Hi Steve

What have you done to minimize your defects?


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Tuesday, March 04, 2008 12:19 PM
To: [log in to unmask]
Subject: Re: [TN] Leadfree trends

Hi Inge!

Here's your chart:

http://stevezeva.homestead.com/files/Defect_Spectrum.jpg

From my experience, it's not that bad. Have had a few more tombstones
with LF than I've seen in a long time, and a little more opens due to
not wetting as well. But I can't say that I've seen more of the other
three defects....

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Tuesday, March 04, 2008 10:45 AM
To: [log in to unmask]
Subject: [TN] Leadfree trends

First, I would like to present a table from Agilent 2006 on the failure
rate difference between leaded and leadfree soldering (with some help
from Steve Gregory). Is it still that bad? Wait for link.

Then, I would like to know if someone got reliable and independent and
SHORT information on trends the nearest five years for SAC305 and SAC100
and others about:

Voiding
Tombstoning
Insufficient barrel fill
Bridging
Tin whiskers
Compound changes (like silver content, rheology etc) Solder temperature
Component finish Selected board material and finish

I suppose Mike Fenner has, but he may be not quite 'independent' 
(no,Mike, not your partnership, but from your profession )

/Inge

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