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Subject:	Re: QFN Thermal Plane Voiding
From:	"David D. Hillman" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Wed, 5 Mar 2008 08:14:07 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (65 lines)

Hi Vector! Where is the 25% requirement in A610? I did not find a 
requirement listed for the thermal pad coverage. 

Dave Hillman
Rockwell Collins
[log in to unmask]




Victor Hernandez <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
03/05/2008 07:49 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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To
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Subject
[TN] QFN Thermal Plane Voiding






Fellow TechNetters:

The 25% solder voiding has been an accepted rule of thumb for QFN, Quad
Flat w/No Leads, IPC-A-610D sec. 8.2.13.   Is there any other guideline
out there.

Victor,



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