We do not see a significant difference in DPMO on Pb-Free vs. SnPb builds,
when the designs are similar.
We do see increased problems with plastics and epoxy, poor survivability in
high aspect ration PTH, reduced success rates with board rework / repair and
increased assembly cost and reduced through-put due to increased
requirements to mitigate moisture sensitivity.
One positive thing, we have much better results from pin-in-paste. The
higher surface tension seems to work for us in this application.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Tuesday, March 04, 2008 1:19 PM
To: [log in to unmask]
Subject: Re: [TN] Leadfree trends
Hi Inge!
Here's your chart:
http://stevezeva.homestead.com/files/Defect_Spectrum.jpg
From my experience, it's not that bad. Have had a few more tombstones
with LF than I've seen in a long time, and a little more opens due to
not wetting as well. But I can't say that I've seen more of the other
three defects....
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Tuesday, March 04, 2008 10:45 AM
To: [log in to unmask]
Subject: [TN] Leadfree trends
First, I would like to present a table from Agilent 2006 on the failure
rate difference between leaded and leadfree soldering (with some help
from Steve Gregory). Is it still that bad? Wait for link.
Then, I would like to know if someone got reliable and independent and
SHORT information on trends the nearest five years for SAC305 and SAC100
and others about:
Voiding
Tombstoning
Insufficient barrel fill
Bridging
Tin whiskers
Compound changes (like silver content, rheology etc) Solder temperature
Component finish Selected board material and finish
I suppose Mike Fenner has, but he may be not quite 'independent'
(no,Mike, not your partnership, but from your profession )
/Inge
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