Thanks Stephen, but I'm not talking about laser vias.  I'm talking about
mechanically drilled vias (0.200mm or 0.250mm) through several layers. 

-----Original Message-----
From: Stephen Pierce [mailto:[log in to unmask]] 
Sent: Tuesday, March 04, 2008 2:39 PM
To: 'TechNet E-Mail Forum'; rgrant
Subject: RE: [TN] Filled and plated blind via fab note

Am I correct in assuming that you are referring to filling laser blind
vias
on the board surface?

There are very few fill materials 'in the wild' that have been
specifically
developed for such a purpose, none that I know of available in North
America.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ryan Grant
Sent: Tuesday, March 04, 2008 1:26 PM
To: [log in to unmask]
Subject: [TN] Filled and plated blind via fab note

Hi All,

I have a board I want to ensure the blind vias are filled with resin,
planarized then plated over with copper.  My shops are pretty good at
giving me what I want; even if I don't ask for it :)  But I would like
to ask for it right!  Can anyone give suggestions on how to word the fab
note?

(I still remember Steve's photo of SMT pads that had bumps on them
because the shop didn't properly planarize the resin in the filled vias
before final plating, and I want to avoid that...)

Thanks,
Ryan

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