IPC forum members were advised last fall of this joint IPC/ECA/JEDEC effort. This document has broad support from component suppliers and it is likely that users will see classification and labeling on component packaging based on this standard. You are running out of opportunities to assure that it meets your needs.

J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes is an outgrowth of IPC/JEDEC J-STD-020 "Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices" and IPC-9503 Moisture Sensitivity Classification for Non-IC Components. These two documents focus on issues related to moisture absorption in non-hermetic electronic components. J-STD-075 is intended as a gap filler to test and classify components that may be damaged from thermal damage during the assembly process.

While the document being balloted does not incorporate moisture sensitivity testing or classification for passives or other components, it has undergone significant change to thermal classification requirements since the version circulated last fall.

The current ballot circulation message is below. This advises how you can download the ballot draft and submit comments. Balloting will provide the greatest committee attention. The next joint working group meeting will be at APEX in Las Vegas Monday March 31, 2008 from 8:00 to 5:00. www.goipcshows.org has meeting info. Event registration is required but advance registration is free.

Jack

-----Original Message-----
From: Jack Crawford
Sent: Sunday, March 02, 2008 1:01 PM
To: Steve Martell ([log in to unmask]); Jack McCullen; [log in to unmask]
Cc: Ken McGhee ([log in to unmask]); [log in to unmask]; Jack Crawford
Subject: J-STD-075 March 08 Committee Ballot is Available

This ballot announcement message is being sent in the blind to all members of record of the IPC B-10a task group and others that have expressed interest in the J-STD-075 project. If you no longer wish to receive messages about this project please reply to sender.

Development of this document is a joint effort of IPC, ECA and JEDEC. Some recipients of this announcement are members of two or more of these associations and may receive separate ballot announcements from those associations. It is only necessary to submit one ballot.

Since IPC is an accredited standard developing association in accordance with rules established by the American National Standards Institute, all IPC documents are circulated at the "Proposed Standard for Ballot" stage to the members of the task group where the document originated. Anyone is welcome to submit comments and ballots.

A copy of J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes is available for your review. The file is in PDF format and can be opened with the freeware Adobe Acrobat Reader (www.adobe.com). Included with the file is a ballot comment form.

The document, comment list and comment form can be downloaded from:
http://files.ipc.org/J075-Ballot-Mar08.zip

We are now using an online survey tool to enable you to more easily submit your vote. After you have reviewed the document, please access the following link to submit your ballot:
http://www.surveymonkey.com/s.aspx?sm=23u_2f1Hu3EJVcLC_2bUAgaT_2fw_3d_3d

PLEASE NOTE THAT ONLY ONE VOTE CAN BE COUNTED PER COMPANY SITE.

If you have comments, please return the comment form to [log in to unmask] with "J075 comments" in the subject line. All technical comments must be responded to in writing from the task group leaders and the IPC staff. These records become a permanent part of the document file. If the comments are editorial in nature, they can be incorporated and need no official response. Editorial comments are not grounds for rejection.

Please return all comments to Jack Crawford at IPC Headquarters as soon as possible, or by March 26, 2008 at the latest.

We would like to give special thanks to Steve Martell, Sonoscan, (IPC B-10a committee), and to Jack McCullen, Intel Corporation (JEDEC committee) and Paul Krystek, IBM Corporation (ECA committee), for leading this important project.

Jack Crawford, IOM
IPC Director Certification and Assembly Technology [log in to unmask]
847-597-2893
FAX 847-615-5693
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL, 60015

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