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Date: | Tue, 4 Mar 2008 12:19:05 -0600 |
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Hi Inge!
Here's your chart:
http://stevezeva.homestead.com/files/Defect_Spectrum.jpg
From my experience, it's not that bad. Have had a few more tombstones
with LF than I've seen in a long time, and a little more opens due to
not wetting as well. But I can't say that I've seen more of the other
three defects....
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Tuesday, March 04, 2008 10:45 AM
To: [log in to unmask]
Subject: [TN] Leadfree trends
First, I would like to present a table from Agilent 2006 on the failure
rate difference between leaded and leadfree soldering (with some help
from Steve Gregory). Is it still that bad? Wait for link.
Then, I would like to know if someone got reliable and independent and
SHORT information on trends the nearest five years for SAC305 and SAC100
and others about:
Voiding
Tombstoning
Insufficient barrel fill
Bridging
Tin whiskers
Compound changes (like silver content, rheology etc) Solder temperature
Component finish Selected board material and finish
I suppose Mike Fenner has, but he may be not quite 'independent'
(no,Mike, not your partnership, but from your profession )
/Inge
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