Hello,
I am interested in reballing/rebumping BGAs and replacing the SAC305 solder
spheres with 62/2/36 but would like to know if there is any reliability data
or at least a white paper or study published on the subject.
If there are no papers or studies available, would anyone venture an opinion
on how will the extra silver (compared to 63/37) effect the solder joint?
Will the extra silver help lessen cyclic creep-fatigue?
Thank you in advance for your responses.
Thank you,
David Tremmel
Value Recovery
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