Oh, now I understand.  They want to flash plate the blank panel with
10u", mask the blank panel with only select areas exposed for further
plating of 30u".  Then etch out the pattern of traces and such.  (Which
is what everyone has already said...)

Ugh.  Not for me, not ever!  I've seen a few good shops use the same
etching to remove the skinny tie bars.  It always etches the copper
faster than the nickel, leaving tiny a trace width length of slivers.
An entire board full of sliver?  Yuck!

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Franklin D Asbell
Sent: Friday, March 28, 2008 2:12 PM
To: [log in to unmask]
Subject: Re: [TN] Gold Flash vs. ENIG Solder finish

He saying they want to stop performing the ENIG and perform full body
and selective gold plate. Each of these would be 'pattern plating' and
thus end the need for a tie bar.

You only need tie bars when you perform tab like plating, not selective
or full body pattern plate.

Franklin

-----Original Message-----
>From: Ryan Grant <[log in to unmask]>
>Sent: Mar 28, 2008 2:26 PM
>To: [log in to unmask]
>Subject: Re: [TN] Gold Flash vs. ENIG Solder finish
>
>???? The explanation doesn't make sense.  ENIG does not need the tie
>bars removed and the tie bars must be removed after hard Au plating
>regardless of any surface finish. 
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Lefebvre
>Sent: Thursday, March 27, 2008 10:02 AM
>To: [log in to unmask]
>Subject: [TN] Gold Flash vs. ENIG Solder finish
>
>I have a FAB house that is recommending we switch from using ENIG for
>the main body with electroplated hard gold for the edge fingers to an
>alternate finish.  They are recommending Gold Flash *Finish the entire
>board with 3-10 micro inches of hard Au over 100-200 micro-inches of Ni
>and selectively Au plate fingers with 30-50 micro-inches of hard Au.
>They reason they want us to change is it removes the step of removing
>the tie-bars on the gold edge fingers.
> 
>Would this have an affect with solderability switching to Gold Flash?
> 
> 
>Scott 
> 
>
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