???? The explanation doesn't make sense. ENIG does not need the tie
bars removed and the tie bars must be removed after hard Au plating
regardless of any surface finish.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Lefebvre
Sent: Thursday, March 27, 2008 10:02 AM
To: [log in to unmask]
Subject: [TN] Gold Flash vs. ENIG Solder finish
I have a FAB house that is recommending we switch from using ENIG for
the main body with electroplated hard gold for the edge fingers to an
alternate finish. They are recommending Gold Flash *Finish the entire
board with 3-10 micro inches of hard Au over 100-200 micro-inches of Ni
and selectively Au plate fingers with 30-50 micro-inches of hard Au.
They reason they want us to change is it removes the step of removing
the tie-bars on the gold edge fingers.
Would this have an affect with solderability switching to Gold Flash?
Scott
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