I have a FAB house that is recommending we switch from using ENIG for
the main body with electroplated hard gold for the edge fingers to an
alternate finish.  They are recommending Gold Flash *Finish the entire
board with 3-10 micro inches of hard Au over 100-200 micro-inches of Ni
and selectively Au plate fingers with 30-50 micro-inches of hard Au.
They reason they want us to change is it removes the step of removing
the tie-bars on the gold edge fingers.
 
Would this have an affect with solderability switching to Gold Flash?
 
 
Scott 
 

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