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March 2008

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Mon, 24 Mar 2008 07:26:10 -0700
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Socially transmitted disease and an old term soldering temperature duration, which related to time an iron was held to a joint or dwell in a solder fountain or contact time across the wave.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
Sent: Thursday, March 20, 2008 12:45 PM
To: [log in to unmask]
Subject: [TN] J-STD-33 and 33B.1

Hello TechNet gurus,

 

In a former life I was responsible for a BGA reballing operation and the
bake-in / bake-out times and temps was based on J-STD-33.  A typical leaded
PBGA was MSL 3 and we baked it for 24 hrs at 125°C yaddah, yaddah, yaddah.

 

According to J-STD-33B.1 it appears that the same component now has a bake
time of 27 hrs and not 24 hrs?  I understand the same PBGA going from a lead
to a lead-free package and from MSL 3 to MSL 4.  But why were the 3 hours
added between the 2 standards?

 

Also, I realize that STD is short for STanDard, but doesn't STD also mean
something else?

 

 

Thank you in advance for your replies.

 

 

Thank you,

 

David Tremmel

Value Recovery

 


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