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March 2008

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Subject:
From:
Louis Hart <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Louis Hart <[log in to unmask]>
Date:
Fri, 21 Mar 2008 10:20:13 -0400
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TechNetters, a question has come up in our plant about cleaning copper surfaces before HASL. (Solder used is the standard tin-lead.) We've been putting panels through a light acid clean and etch, then through a Quicksilver flux applicator with two rollers that appear to be saturated with Enthone 757 SG flux. Someone has asked if that acid clean and etch are really necessary, since what is flux supposed to do?

Any comments on the need for the acid clean and etch would be most welcome.

Many thanks - Louis

Louis Hart
Compunetics
Monroeville, PA
USA
[log in to unmask]<mailto:[log in to unmask]>
412-858-1272


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