Subject: | |
From: | |
Reply To: | |
Date: | Wed, 19 Mar 2008 18:34:29 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Vladamir,
They are filled, but not copper filled
Franklin
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
Sent: Tuesday, March 18, 2008 10:01 PM
To: [log in to unmask]
Subject: Re: [TN] How much stress is needed?
That is what I initially thought, but didn't Franklin mean Cu filled via???
Vladimir
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Mar 18 22:44:41 2008
Subject: Re: [TN] How much stress is needed?
Hi Franklin,
You describe a classic via barrel crack—comes from the thermal expansion
mismatch between the ED copper and the PCB resin in the z-direction during the
soldering processes [the hotter the worse—read lead-free] [you should be taking
my workshop on the subject at IPC EXPO/APEX on the morniong of March 31.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
**************
Create a Home Theater Like the Pros. Watch the video on AOL
Home.
(http://home.aol.com/diy/home-improvement-eric-stromer?video=15?ncid=aolhom00030000000001)
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|