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March 2008

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Subject:
Re: Case of the popping BGAs
From:
"Igoshev, Vladimir" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Igoshev, Vladimir
Date:
Wed, 19 Mar 2008 17:12:21 -0400
Content-Type:
text/plain
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text/plain (52 lines) 
It could be some flux residue which was left entrapped in the joints. 

Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
Sent: Wednesday, March 19, 2008 5:02 PM
To: [log in to unmask]
Subject: Re: [TN] Case of the popping BGAs

Any idea where all the Carbon came from in a solder joint?
Contamination 
after fracture?  Are they measuring the laminate or solder  mask around
the pad?
 
Denny Fritz
MacDermid, Inc.  



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