That is another reason I wouldn't do quant on a fracture surface :-)

Vladimir

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Wednesday, March 19, 2008 5:03 PM
To: [log in to unmask]
Subject: Re: [TN] Case of the popping BGAs


 

Maybe I missed something.  I would expect
Werner,

 

Maybe I missed something.  I would expect that if one looked at the BGA
ball side of a fracture you would see something completely different
from the 35-50%Ni, 20%Sn, and a couple of percent Pb that they
indicated.  I think that some of the fractures might have occurred at
the solder ball  / BGA package interface and that they were looking at
the package side of those fractures rather than the ball side of a
fracture at the PCBA.

 

Regards,

George

George M. Wenger

Andrew Wireless Solutions

Senior Principal FMA / Reliability Engineer

40 Technology Drive, Warren, NJ 07059

(908) 546-4531 [Office]  (732) 309-8964 [Cell]

[log in to unmask]

 

________________________________

From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Wednesday, March 19, 2008 4:50 PM
To: Wenger, George M.; [log in to unmask]
Subject: Re: [TN] Case of the popping BGAs

 

Hi George,
The ball-side fracture surfaces were measured and described.



Werner



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