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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Wed, 19 Mar 2008 17:02:53 -0400
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Maybe I missed something.  I would expect
Werner,



 



Maybe I missed something.  I would expect that if one looked at the BGA

ball side of a fracture you would see something completely different

from the 35-50%Ni, 20%Sn, and a couple of percent Pb that they

indicated.  I think that some of the fractures might have occurred at

the solder ball  / BGA package interface and that they were looking at

the package side of those fractures rather than the ball side of a

fracture at the PCBA.



 



Regards,



George



George M. Wenger



Andrew Wireless Solutions



Senior Principal FMA / Reliability Engineer



40 Technology Drive, Warren, NJ 07059



(908) 546-4531 [Office]  (732) 309-8964 [Cell]



[log in to unmask]



 



________________________________



From: [log in to unmask] [mailto:[log in to unmask]] 

Sent: Wednesday, March 19, 2008 4:50 PM

To: Wenger, George M.; [log in to unmask]

Subject: Re: [TN] Case of the popping BGAs



 



Hi George,

The ball-side fracture surfaces were measured and described.







Werner







**************

Create a Home Theater Like the Pros. Watch the video on AOL Home.

(http://home.aol.com/diy/home-improvement-eric-stromer?video=15?ncid=aol

hom00030000000001)



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