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March 2008

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Subject:
From:
"Kirk, Graham (GE EntSol, Intelligent Platforms)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kirk, Graham (GE EntSol, Intelligent Platforms) <[log in to unmask]>
Date:
Tue, 18 Mar 2008 12:05:47 -0000
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Hi Joyce,

I realize that CTE mismatch is responsible for the fatigue, I am trying
to understand why the solder mask has so much effect on the solder
joint.

Graham Kirk

Senior Technologist

Radstone Embedded Computing

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: 18 March 2008 11:07
To: [log in to unmask]
Subject: Re: [TN] Solder Mask Defined Pad BGA Reliability

Fatique, due to CTE mismatch or poor design.  My 1st guess.
Jk
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Mar 18 06:18:08 2008
Subject: [TN] Solder Mask Defined Pad BGA Reliability

Hi All,

 

 

 

Can anybody tell me what the actual mechanism is that propagates cracks
in the device to ball joint on plastic BGA's (Leaded balls) with SMD
pads under thermal cycling? 

 

 

 

Graham Kirk

 

Senior Technologist

 

GE Fanuc Intelligent Platforms Ltd 

 


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