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March 2008

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Tue, 18 Mar 2008 07:07:17 -0400
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text/plain
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Fatique, due to CTE mismatch or poor design.  My 1st guess.
Jk
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Mar 18 06:18:08 2008
Subject: [TN] Solder Mask Defined Pad BGA Reliability

Hi All,

 

 

 

Can anybody tell me what the actual mechanism is that propagates cracks
in the device to ball joint on plastic BGA's (Leaded balls) with SMD
pads under thermal cycling? 

 

 

 

Graham Kirk

 

Senior Technologist

 

GE Fanuc Intelligent Platforms Ltd 

 


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