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March 2008

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Subject:
From:
"Kirk, Graham (GE EntSol, Intelligent Platforms)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kirk, Graham (GE EntSol, Intelligent Platforms) <[log in to unmask]>
Date:
Tue, 18 Mar 2008 10:18:08 -0000
Content-Type:
text/plain
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text/plain (41 lines)
Hi All,

 

 

 

Can anybody tell me what the actual mechanism is that propagates cracks
in the device to ball joint on plastic BGA's (Leaded balls) with SMD
pads under thermal cycling? 

 

 

 

Graham Kirk

 

Senior Technologist

 

GE Fanuc Intelligent Platforms Ltd 

 


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