TECHNET Archives

March 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Mon, 3 Mar 2008 10:01:02 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (65 lines)
Werner,

I have found that another large factor is the lead width to pad ratio, assuming that the pads are the same size for each part...This ratio effects the fillet size, which then drives the ultimate joint strength...

Paul

Paul Edwards
Surface Art Engineering

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Monday, March 03, 2008 7:55 AM
To: [log in to unmask]
Subject: Re: [TN] Lead Shape

Hi Paul,
No, lead shape is not totally arbitrary, since the lead cross-section,
together with its length and material properties determine the lead stiffness. The
lead stiffness is important in determining the reliability of the solder joints
(see IPC-D-279). Thus, QFP solder joints are more reliable than TSOP solder
joints.



Werner



**************
It's Tax Time! Get tips, forms, and advice on AOL Money &amp;
Finance.
      (http://money.aol.com/tax?NCID=aolprf00030000000001)

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

==============================================================================

This email and any attachments thereto may contain private, confidential, and
privileged material for the sole use of the intended recipient. Any review, copying,
or distribution of this email (or any attachments thereto) by others is strictly prohibited.
If you are not the intended recipient, please contact [log in to unmask]
immediately and permanently delete the original and any copies of this email and
any attachments thereto. 

==============================================================================


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2