Hi Werenr,

May I be able to know your general opinion about this type of packages by any chance?
Specially if your possible point of view about the defects over the temperature range may encounter during reflow process.

From where I am seeing it is going to be less component or PCB warpage due to the CTE and stiffness mismatch.
But from the other hand I am not sure how the PCB by itself would handle the thermal cycling. Delamination, kinking, buckling due to the tension/compression and shear at the interfaces.
Any advice?

Thanks,
Al


[log in to unmask] wrote: Hi Al,
 Indeed it would have to conform to the 9701 mandated requirements, mainly thickness.
 On the other hand, 9701 allows deviations of the mandated requirements as long as they are fully documented.
 
 
 
 Werner
 


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