Yannick: When Tin is plated on to Copper, it spontaneously, immediately begins to form an intermetallic layer at the interface between the Copper and Tin.
When the entire Tin layer becomes a Copper/Tin intermetallic, the surface becomes insolderable, even if no oxidation is present.
Normally this time to form a complete intermetallic is considered to be 6 months, and that is if you fabricator has his plating bath right...
It would appear, even if you could seal up the board, there is little hope in it remaining solderable for a year.
Rudy Sedlak
Yannick Brisson <[log in to unmask]> wrote: Thank you
I can't do that because the board is already in use and the case is not sealed. So I can't seal it.
YB
-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]]De la part de Joyce Koo
Envoyé : 13 mars, 2008 09:46
À : [log in to unmask]
Objet : Re: [TN] Board Oxydation
Rp system and seal it in moisture barrier bag,
Jk
--------------------------
Sent using BlackBerry
----- Original Message -----
From: TechNet
To: [log in to unmask]
Sent: Thu Mar 13 09:29:21 2008
Subject: [TN] Board Oxydation
Hi,
I would like to know, if we plate a board with Immersion TIN, On the board we need to use 1 screw but it could spend maybe one year before we place it ( the screw is to plug a ground from another card. So the board could be oxydize. Will it make a good contact. What you guys do??
Thank You
Yannick
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