I am wondering how tightly others control their solderpaste print height.
   
  Assuming SAC305, type 4 paste, 5 mil thick stainless steel stencil, ss blade, and a DEK printer, and Cyberoptics laser inspection system, what is a reasonable process tolerance?
   
  Is 4.6 to 7.4 mils acceptable?
   
  My experience had always been successful with a tighter tolerance (like 5.0-6.0 mils), but I am being hard pressed to open this up.
   
  I realize the larger aperture permit for scooping to happen, but I try to eliminate such occurrences by design.  
   
  I have always tried to dial in the print operation such that brick shapes resulted, but as the limit of the stencil aspect ratios are approached, the shape release forces alter the brick into a gum drop shape.
   
  Thanks in advance.
   
  Phil

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