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March 2008

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Tue, 11 Mar 2008 11:50:50 -0400
Content-Type:
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text/plain (27 lines)
Hi everybody,

And thanks again for you counselling. ENIG seems to be OK and that suits
me fine.

Eric was dead on, it is about bonding a connector to a rigid, 0.031"
thick PCB. The application is medical and that is about all I am allowed
to say to answer Inge's question.

Sadly, we only do the stuffing of the PCB and the juicy part, bonding,
is done by our customer at their own facility! So the answers I've got
here are the closest I will get to this technology.

Best regards,

Ioan

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