Inge, Wayne,

 

Thanks for the replies!

 

There is a correction I have to make and I hope you will forgive me, but I am a complete layman when it comes to bonding.

 

We are talking about ACF bonding... How will this affect the surface finishing?

 

Thank you,

 

Ioan

 

________________________________

De : Ioan Tempea 
Envoyé : 7 mars 2008 08:06
À : 'TechNet E-Mail Forum'
Objet : Bonding on ENIG

 

Hi Technos,

 

A connector has to be bonded on 2 mil wide traces. Is ENIG suited as a surface finish for bonding? If yes, why, if not, why and if it depends, why?

 

Or otherwise said, I have a PCB that will get some SMT parts on both sides and then a couple hundred golden fingers will see bonding. I was presented with 2 options for the PCB finish:

a) Immersion Gold : 0.03um Au over 3um Ni over 25±10um Cu

b) ElectroBonding Gold: 0.3um Au over 3um Ni over 25±10um Cu

 

Which one is to prefer?

 

Thank you,

 

Ioan


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------