First, I would like to present a table from Agilent 2006 on the failure rate
difference between leaded and leadfree soldering (with some help from Steve
Gregory). Is it still that bad? Wait for link.

Then, I would like to know if someone got reliable and independent and SHORT
information on trends the nearest five years for SAC305 and SAC100 and
others about:

Voiding
Tombstoning
Insufficient barrel fill
Bridging
Tin whiskers
Compound changes (like silver content, rheology etc)
Solder temperature
Component finish
Selected board material and finish

I suppose Mike Fenner has, but he may be not quite 'independent' 
(no,Mike, not your partnership, but from your profession )

/Inge

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