TGASIA Archives

March 2008

TGAsia@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, Timmy Ni <[log in to unmask]>
Date:
Wed, 26 Mar 2008 15:47:27 +0800
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, Cony Su <[log in to unmask]>
Subject:
Re: 答复: [TGA] thickness of solde r paste vs compontents soldering area
From:
Cony Su <[log in to unmask]>
In-Reply-To:
A<005b01c88f05$8db0c5c0$3503a8c0@Roychen>
Content-Type:
multipart/alternative; boundary="----_=_NextPart_001_01C88F15.A3BB816E"
MIME-Version:
1.0
Parts/Attachments:
text/plain (2246 bytes) , text/html (14 kB)

ATOM RSS1 RSS2