TECHNET Archives

February 2008

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Minimum Heel Fillet Height
From:
Herminia Guevarra <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Herminia Guevarra <[log in to unmask]>
Date:
Wed, 13 Feb 2008 18:00:50 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (45 lines) 
Hi, folks,

 

Can anybody please explain in details how the minimum heel fillet height
criteria for Class 2 was computed and specified?

 

F= solder thickness (G) + 50% lead thickness

 

Can solder thickness be solder paste height prior reflow?

 

What about if leads are not coplanar?  What would be the spec for co
planarity?  How can they be measured?

 

Need reply...

 

Thanks,

 

Herminia 

 


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2