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| Date: | Wed, 13 Feb 2008 16:35:08 +0100 |
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In the lead to the development of lead free solders begin 1990's, I
studied the resistance to fatigue (temperature cycling -20/+120dC)
with SnPb as a reference. The solders were SnCu0.7, SnAg3.7 and among
others SAC.
There was no difference found between SAC and SnAg3.7
The ratio for # of cycles to faillure between SnPb : SnCu0.7 :
SnAg3.7 : SAC is 1.0 : 0.7 : 1.2 : 1.1.
The results coincided with the later reports from NCMS August 1997
(final report lead free solder project), DTI 2001? (lead free
soldering) and the results from the IDEALS project (1999).
Peer Langeveld
Consultant Soft Soldering Processes
5502 VH 8
The Netherlands
2008/2/13, Stolar, Paul W <[log in to unmask]>:
> Paul Stolar
> Materials/Reliability Engineer
> Manufacturing Reliability Lead Engineer
> Baker Atlas
> 713-625-5376
> 713-625-4949 (fax)
>
> Has anyone ever compared SAC solders with Sn96Ag3.5 for reliability?
>
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