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Date: | Wed, 13 Feb 2008 16:24:45 +0200 |
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Hi Philip,
The Samsung Memory BGAs are Lead free balls (is it?).
Are you using Sn Pb process or lead free process?
Reuven
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phillip Bavaro
Sent: Wednesday, February 13, 2008 3:59 AM
To: [log in to unmask]
Subject: [TN] Samsung Memory BGA Failure
I am wondering if anyone else out there has run into a problem with a
Samsung Flash memory device (in this case, the 0.8 mm pitch, 107 pin
sac305
BGA) where the connections are cracking right at the interface between
the
pwb and ball.
I had read about some Samsung BGA problems but cannot find the link to
the
information now.
We have other BGA's on the same board without any issues. Shear
strength
test results are very low as well (if the flash has not already popped
off
by itself).
I'll try to get some pictures to Steve to put up tonight. My current
thoughts are CTE's are grossly mis-matched as we haven't found anything
on
the pads to account for the gross failure.
Thanks in advance,
Phil
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