What % of the interface is fractured?

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of bob wettermann
Sent: Wednesday, February 13, 2008 5:29 AM
To: [log in to unmask]
Subject: Re: [TN] Samsung Memory BGA Failure

Dear Phil:

1. Have you done a dye and pry and confirmed that is indead the
ball/board interface?


2. Have you completed an analysis of the pad to determine what if any
constitutes are o the pads?

3. Are the cracks or opens across all areas of the BGA or just corners
or one area?

Bob Wettermann
BEST
Phillip Bavaro <[log in to unmask]> wrote: I am wondering if
anyone else out there has run into a problem with a 
Samsung Flash memory device (in this case, the 0.8 mm pitch, 107 pin
sac305 
BGA) where the connections are cracking right at the interface between
the 
pwb and ball.

I had read about some Samsung BGA problems but cannot find the link to
the 
information now.

We have other BGA's on the same board without any issues.  Shear
strength 
test results are very low as well (if the flash has not already popped
off 
by itself).

I'll try to get some pictures to Steve to put up tonight.  My current 
thoughts are CTE's are grossly mis-matched as we haven't found anything
on 
the pads to account for the gross failure.

Thanks in advance,

Phil

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Bob Wettermann
PH 847-767-5745

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