Dear Phil:

1. Have you done a dye and pry and confirmed that is indead the ball/board interface?


2. Have you completed an analysis of the pad to determine what if any constitutes are o the pads?

3. Are the cracks or opens across all areas of the BGA or just corners or one area?

Bob Wettermann
BEST
Phillip Bavaro <[log in to unmask]> wrote: I am wondering if anyone else out there has run into a problem with a 
Samsung Flash memory device (in this case, the 0.8 mm pitch, 107 pin sac305 
BGA) where the connections are cracking right at the interface between the 
pwb and ball.

I had read about some Samsung BGA problems but cannot find the link to the 
information now.

We have other BGA's on the same board without any issues.  Shear strength 
test results are very low as well (if the flash has not already popped off 
by itself).

I'll try to get some pictures to Steve to put up tonight.  My current 
thoughts are CTE's are grossly mis-matched as we haven't found anything on 
the pads to account for the gross failure.

Thanks in advance,

Phil

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Bob Wettermann
PH 847-767-5745

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