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February 2008

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Tue, 12 Feb 2008 15:18:01 -0800
Content-Type:
text/plain
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text/plain (156 lines)
I thought diffuse was what a bad design referred to when limiting the
current by reducing the trace width...................

Is it Friday yet?? Get me outta
here......................................8-)

 
 
John Burke
 
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
Sent: Tuesday, February 12, 2008 3:09 PM
To: [log in to unmask]
Subject: Re: [TN] Through Hole Pad Solder Non-Wetting

Diffuse is even a better one. :-)

----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Feb 12 17:50:52 2008
Subject: Re: [TN] Through Hole Pad Solder Non-Wetting

Migrate is a better word than leach, sorry. 
I've been thinking about fishing for walleyes too much.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, February 12, 2008 4:45 PM
To: [log in to unmask]
Subject: Re: [TN] Through Hole Pad Solder Non-Wetting

No, it is not. Standard ENIG is optimally 150 uinches of nickel, with
between 3-6 uinches of gold over it, per the IPC spec. What Paymon has is
not ENIG.

Electroless Nickel Thickness APPENDIX 4 3.2.1
3 to 6 ìm
[118.1 to 236.2 ìin]
Immersion Gold Thickness APPENDIX 4 0
0.05 ìm minimum
[1.97 ìin minimum]

Paymon, if you in fact have only 1-3 uinches of nickel, you are really
screwed.
Even if you have 1-3 um of nickel, you are under the minimum of 3 um.
This will cause the copper to leach through the nickel and react with the
gold, and cause all kinds of solderability issues.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
Sent: Tuesday, February 12, 2008 2:41 PM
To: [log in to unmask]
Subject: Re: [TN] Through Hole Pad Solder Non-Wetting

Sorry, I'm always confused with microinches and microns. :-( The thickness
is fine.

Vladimir

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Tuesday, February 12, 2008 2:30 PM
To: [log in to unmask]
Subject: [TN] Through Hole Pad Solder Non-Wetting

Hello All,

 

We experienced solder non-wetting to a PCB through-hole component pad
surface. The PCB surface finish is ENIG. The microsection results from the
suspect PCBs show that the Nickel plating is thin from 1 to 3 micro-inches.
We related the thin Nickel plating to Nickel corrosion and PCB surface
non-wetting. However, the microsection also revealed copper corrosion at
Copper to Nickel interface! I have never seen the copper corrosion in the
past and I would like to ask if any of you has a similar experience in the
past. What could be the cause of copper corrosion? I have few images if you
are interested to see them.

 

Regards,

Paymon


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