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Subject:	Re: Microvoids immersion silver
From:	Gabriela Bogdan <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Gabriela Bogdan <[log in to unmask]>
Date:	Mon, 4 Feb 2008 21:54:48 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (47 lines)

Finished my "investigation". Attached word doc,  Steve, could you put it on your site?
Can anybody comment or give an advice?
Thanks,
Gaby
  ----- Original Message ----- 
  From: Gabriela Bogdan 
  To: [log in to unmask] ; [log in to unmask] 
  Sent: Tuesday, January 29, 2008 8:49 PM
  Subject: Re: [TN] Microvoids immersion silver


  Decided to investigate further to qualify our vendors.
  4BGA + 2 circuits and assembly.
  Will cross section bare, after paste+reflow, after BGA assembly and also X-ray and dye and pry.
  At least I will have fun.
  Gaby
    ----- Original Message ----- 
    From: [log in to unmask] 
    To: [log in to unmask] ; [log in to unmask] 
    Sent: Tuesday, January 29, 2008 8:35 PM
    Subject: Re: [TN] Microvoids immersion silver


    Hi Gaby,
    I take it what you are seeing are 'champagne voids.'
    Voids like these are 'encouraged by rough topography copper, excessive Ag thickness, some solder paste choices and rapid cool-down after reflow. But as Donald Cullen says in his comprehensive paper, it "requires the “Perfect Storm” of a rather contrived combination of parameters" to produce planar micro-voiding.
    Well Gaby, now you know it—you are "Perfect." ;-)



    Werner



    **************
    Start the year off right. Easy ways to stay in shape.
    http://body.aol.com/fitness/winter-exercise?NCID=aolcmp00300000002489 
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